[1]
[2] Ai Kecong. Development and prospect of low-light-level(LLL) night vision technology[J]. Applied Optics, 2006, 27(4):303-307.(in Chinese) 艾克聪.微光夜视技术的进展与展望[J]. 应用光学, 2006, 27(4):303-307.
[3]
[4] Estrera Joseph P, Bender E J, Adriana Giordana, et al. Long lifetime generation Ⅳ image intensifier with unfilmed microchannel plate[C]//SPIE, 2000, 4128:46-53.
[5]
[6] Xiang Rong, Wang Guozheng, Chen Li, et al. Etching technology of Si-based two dimension deep microchannel array[J]. Micronanoelectronic Technology, 2008, 45(12):729-733.(in Chinese) 向嵘,王国政,陈立,等. Si基体二维深通道微孔阵列刻蚀技术[J]. 微纳电子技术, 2008, 45(12):729-733.
[7]
[8] Guo Yanling. Continuous dynode of advanced technology microchannel plate research[D]. Changchun:Changchun University of Science and Technology, 2006.(in Chinese) 郭艳玲.先进技术微通道板连续打拿极的研究[D]. 长春:长春理工大学, 2006.
[9]
[10] Seidel H, Csepregi L, Heuberger A. Anisotropic etching of crystalline silicon in alkaline solutions[J]. Electrochem Soc, 1990, 1137:3612-3626.
[11] Wang Guozheng, Li Ye, Gao Yanjun, et al. Study on Silicon microchannel plate image intensifier[J]. Chinese Journal of Electron Devices, 2008, 31(1):308-311.(in Chinese) 王国政,李野,高延军,等.硅微通道板像增强器的研究[J]. 电子器件, 2008, 31(1):308-311.
[12]
[13]
[14] Fu Yuxia, Liu Zhihong, Liu Ronghua, et al. Process of Al-reactive Ion etching[J]. Semiconductor Information, 2000, 37(5):37-40.(in Chinese) 付玉霞,刘志弘,刘荣华,等.铝-RIE刻蚀工艺[J]. 半导体情报, 2000, 37(5):37-40.
[15]
[16] Lin Bingtao, Tang Guangqing, Zhou Qian. Study on wet etching process of ST-cut quartz[J]. Piezoelectrics and Acoustooptics, 2014, 36(5):779-781.(in Chinese) 林丙涛,唐光庆,周倩. ST-石英的湿法腐蚀工艺研究[J]. 压电与声光, 2014, 36(5):779-781.
[17] Cui Zheng. Micro-Nanofabrication Technologies and Applications[M]. Beijing:Higher Education Press, 2013:364-365.(in Chinese) 崔铮.微纳米加工技术及其应用[M]. 北京:高等教育出版社, 2013:364-365.
[18]
[19] Yuan Weizheng, Qiao Dayong. Microelectromechanical System[M]. Xi'an:Northwestern Polytechnical University Press, 2011:81-82.(in Chinese) 苑伟政,乔大勇.微机电系统[M]. 西安:西北工业大学出版社, 2011:81-82.