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根据高工作温度探测器组件在单兵、无人机载平台等的应用需求,昆明物理研究所基于探测器组件短光轴长度,低功耗、快速制冷、低成本等设计理念,于2021年为基于InAsSb材料制备的640×512中波高温探测器芯片研发了专门的短冷指膨胀机、低功耗线性制冷机和短光轴长度的封装杜瓦,形成了InAsSb HOT IDDCA组件。
该组件使用的制冷机为昆明物理研究所研制的长寿命、高效率、低振动线性分置式斯特林制冷机C351第一轮样机。该制冷机压缩机的电机采用单磁钢动磁结构,由Robert Redlich发明[17],其结构示意图如图9所示。其结构的特点一是动磁采用径向充磁的单磁钢,二是动磁全行程基本封闭在磁回路中,漏磁很少,故电机效率高,通常可达82%以上,好的设计可超过90%,显著优于早期双磁钢动圈式及双磁钢动磁式电机的效率。另外,由图9可知,该电机结构简单,最低只需六种零件就可构成一个单活塞的制冷压缩机。Redlich电机已成为国外线性制冷机的主流电机结构,后文对比的国外探测器组件用线性制冷机均采用了Redlich电机。
昆明物理所制冷团队对Redlich电机磁路开展了深入的研究,发现在一定的动磁行程内,磁路提供的反作用力与机械弹簧(图9中零件6)的功能是一样的,称其为电磁弹簧,于是在C351制冷机动力学设计时取消了机械弹簧,由磁路在提供活塞推力的同时也承担起机械弹簧的作用,运动结构得到简化。在压缩机外径29 mm、长度58 mm的包络下,电机效率为84%;膨胀机则基于声功回收技术,对150 K温区的热力学进行了优化;制冷机工作于150 K时,在10 Wac输入功率下,制冷量在1 W以上,保证了需要的性能和高效率。杜瓦封装配合F3/F4冷屏设计,高温探测器组件光轴方向的长度为71 mm;探测器组件的总质量小于290 g。InAsSb HOT IDDCA组件结构图如图10所示,组件达到的性能指标如表1所示。
图 9 Redlich型单磁钢动磁式线性压缩机结构示意图
Figure 9. Structural diagram of Redlich single moving magnet linear compressor
表 1 昆明物理研究所InAsSb HOT IDDCA组件的性能参数
Table 1. Performance parameter of KIP’s InAsSb HOT IDDCA components
Parameter Value Focal plane size 640×512 Pixel pitch/μm 15 Operation wavelength/μm 3.6-4.2 Operation temperature of FPA/K 150 Optical axis length/mm 71 Weight/g <290 Power consumption (@23 ℃, steady)/W <3.5 NETD/mK 25 F # F/4 Cooldown time/min 2.5 Cooler type C351 linear cooler MTTF of cooler (Goal)/h >10000 2021年,昆明物理研究所在碲镉汞As注入掺杂p-on-n结构探测器芯片研制取得突破后[18-19],开展了MCT HOT 640 (640×512,15 μm像元中心距)中波高温探测器组件的研发工作。设计了具有更高兼容性的短光轴长度封装杜瓦,即一款杜瓦可封装、采用模拟和数字读出电路的两种MCT 640×512和采用数字读出电路的MCT 1024×768共三个品种的高温探测器芯片;为单兵平台应用专门设计了新的低功耗读出电路,大幅度减少了杜瓦外引线数量,将杜瓦自身热负载降低为初样设计值的70%;对C351制冷机的磁路、出气结构、电机外引线、膨胀机热力学和长度进行了优化设计,制冷量平均提升了20%,形成了C351工程版制冷机;开发了低功耗制冷机驱动电路,将电路功耗降低至0.5 Wdc以下。可工程化批产的MCT HOT IDDCA组件如图11所示。
目前,昆明物理研究所工程化MCT HOT 640中波高温探测器组件典型产品的各项性能指标如表2所示。
表 2 工程化MCT HOT 640中波高温探测器组件典型产品参数测试结果
Table 2. Typical products parameter test results of engineered MCT HOT 640 detector components
Parameter Value Focal plane size 640×512 Pixel pitch/μm 15 Operation wavelength/μm 3.65-4.76 Operation temperature of FPA/K 150 Optical axis length/mm 69.4 Weight/g 259 NETD/mK 15 F# 4 Cooler type C351 linear cooler Power consumption (@23 ℃, cooldown)/Wdc 13.2 Power consumption (@23 ℃, steady)/Wdc 1.96 (with 50 mW additional heat load); 2.35 (with 100 mW additional heat load) Cooldown time (@23 ℃)/s 78 Detector acoustic noise (@1.5 m)/dB 25.7 (@ cooler full speed) MTTF of cooler (Goal)/h >10000 -
昆明物理研究所高工作温度探测器组件的设计思路与国外各探测器组件研制厂商一致,即满足短光轴长度,低功耗、快速制冷、低成本等应用需求,研制的MCT HOT 640探测器组件与国外同类型产品的性能对比如表3所示。
表 3 昆明物理研究所高温MCT HOT 640探测器组件与国外同类型组件性能对比[7-10]
Table 3. Performance comparison of KIP’s MCT HOT 640 detector components with foreign components of the same type[7-10]
Manufacturer Kunming Institute of Physics L3 Harris Technologies Selex DRS Name MCT HOT 640 Onyx Micro SD/HD FIREFLY CAMERA CORE Zafiro®640 Micro Detector picture Detector type MCT MCT MCT MCT Focal plane size 640×512 640×512 640×512 640×480 Pixel pitch/μm 15 15 16 12 Operation wavelength/μm 3.65-4.76 MWIR 3.7-4.95 3.4-4.8 FPA operation temperature/K 150 160 160 160 Optical axis length/mm 69.4 76.2 96 55.88 Weight/g <260 <410 <550 <410 Power consumption@23 ℃, steady Cooler<2.5 Wdc Core: <9 W Core: <5 W Core: <5 W Frame rate/Hz 60 60 60 120 NETD 15 25 25 25 Operable pixel rate >99.8% >99.4% N/A >99% F# F/4 F/4 F/4 F/3.25, F/4 Cooler type C351 linear L200 linear SX020 linear Micro cooler Cooldown time@23℃ Typical<80 s@12 V <6 min Typical<3 min Typical<2.5 min MTBF/h >10000 (Goal) >10000 >25000 >12000
Advance in high operating temperature HgCdTe infrared detector
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摘要: 高工作温度红外探测器组件是第三代红外探测器技术的重要发展方向,可用于高工作温度红外探测器的基础材料主要有锑基和碲镉汞两大类。介绍了昆明物理研究所在高工作温度红外焦平面探测器组件方面的最新研究进展,其中基于碲镉汞材料p-on-n技术研制的高工作温度中波640×512探测器组件在150 K温区性能优异,探测器的噪声等效温差(NETD)小于 20 mK,配置了高效动磁式线性制冷机的高温探测器组件(IDDCA结构),质量小于270 g,探测器组件光轴方向长度小于70 mm(F4),室温环境下组件稳态功耗小于2.5 Wdc,降温时间小于80 s,声学噪声小于27 dB,探测器光轴方向自身振动力最大约1.1 N。目前正在进行环境适应性和可靠性验证,完成后就可实现商用量产。Abstract: High operating temperature (HOT) infrared detector technology is an important branch of the third-generation infrared detector technology. The basic materials that can be used for high operating temperature infrared detectors are mainly Sb based and HgCdTe based. This paper introduces the lasest research progress of high operating temperature infrared focal plane module in Kunming Institute of Physics (KIP). The high operating temperature MCT based detectors developed based on p-on-n technology have reached good performance in the temperature range of 150 K with the NETD less than 20 mK. The weight of MCT 640×512 IDDCA module adapted with high efficiency moving magnet split linear cooler is less than 270 g with the detector length in optical axis direction less than 70 mm (F4). At ambient temperature, the steady power consumption of the module is less than 2.5 Wdc while the cool down time is less than 80 s, audible noise is less than 27 dB and self induced vibration force is less than 1.1 N. MCT HOT modules are now under environmental adaptability and reliability verification and commercial mass production of this detector will be realized after the verification test.
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Key words:
- high operating temperature (HOT) detectors /
- HgCdTe /
- InAsSb /
- p-on-n
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表 1 昆明物理研究所InAsSb HOT IDDCA组件的性能参数
Table 1. Performance parameter of KIP’s InAsSb HOT IDDCA components
Parameter Value Focal plane size 640×512 Pixel pitch/μm 15 Operation wavelength/μm 3.6-4.2 Operation temperature of FPA/K 150 Optical axis length/mm 71 Weight/g <290 Power consumption (@23 ℃, steady)/W <3.5 NETD/mK 25 F # F/4 Cooldown time/min 2.5 Cooler type C351 linear cooler MTTF of cooler (Goal)/h >10000 表 2 工程化MCT HOT 640中波高温探测器组件典型产品参数测试结果
Table 2. Typical products parameter test results of engineered MCT HOT 640 detector components
Parameter Value Focal plane size 640×512 Pixel pitch/μm 15 Operation wavelength/μm 3.65-4.76 Operation temperature of FPA/K 150 Optical axis length/mm 69.4 Weight/g 259 NETD/mK 15 F# 4 Cooler type C351 linear cooler Power consumption (@23 ℃, cooldown)/Wdc 13.2 Power consumption (@23 ℃, steady)/Wdc 1.96 (with 50 mW additional heat load); 2.35 (with 100 mW additional heat load) Cooldown time (@23 ℃)/s 78 Detector acoustic noise (@1.5 m)/dB 25.7 (@ cooler full speed) MTTF of cooler (Goal)/h >10000 表 3 昆明物理研究所高温MCT HOT 640探测器组件与国外同类型组件性能对比[7-10]
Table 3. Performance comparison of KIP’s MCT HOT 640 detector components with foreign components of the same type[7-10]
Manufacturer Kunming Institute of Physics L3 Harris Technologies Selex DRS Name MCT HOT 640 Onyx Micro SD/HD FIREFLY CAMERA CORE Zafiro®640 Micro Detector picture Detector type MCT MCT MCT MCT Focal plane size 640×512 640×512 640×512 640×480 Pixel pitch/μm 15 15 16 12 Operation wavelength/μm 3.65-4.76 MWIR 3.7-4.95 3.4-4.8 FPA operation temperature/K 150 160 160 160 Optical axis length/mm 69.4 76.2 96 55.88 Weight/g <260 <410 <550 <410 Power consumption@23 ℃, steady Cooler<2.5 Wdc Core: <9 W Core: <5 W Core: <5 W Frame rate/Hz 60 60 60 120 NETD 15 25 25 25 Operable pixel rate >99.8% >99.4% N/A >99% F# F/4 F/4 F/4 F/3.25, F/4 Cooler type C351 linear L200 linear SX020 linear Micro cooler Cooldown time@23℃ Typical<80 s@12 V <6 min Typical<3 min Typical<2.5 min MTBF/h >10000 (Goal) >10000 >25000 >12000 -
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