[1]
[2] Chao Yuqing, Yang Zhaojian, Qiao Hailing. Progress on technology of wire bonding[J]. Electronics Process Technology, 2007, 28(4): 205-210. (in Chinese)
[3] Luo Hong. Failure analyses of InSb PV detector no Voc performance[J]. Laser Infrared, 2010, 40(7): 720. (in Chinese)
[4] 晁宇晴, 杨兆健, 乔海灵. 引线键合技术进展[J]. 电子工艺技术, 2007, 28(4): 205-210.
[5]

Xu Shuli, Wang Haizhen. Wet-chamfering techniques for hybrid focal plane arrays[J]. Infrared and Laser Engineering, 2007, 36(S2): 107. (in Chinese)
[6]
[7]

Schealler P, Groning P, Schneuwly A, et al. Surface and friction characterization by thermoelectric measurements during ultrasonic friction processes[C]//Ultrasonics International 1999 Joint with 1999 World Congress on Ultrasonics, 1999, 29(1): 212.
[8]
[9]

Jeng Y R, Aoh J N, Wang C M. Thermosonic wire bonding of gold wire onto copper pad using the saturated interracial phenomena[J]. Journal of Physics D: Applied Physics, 2001, 34, 24(21): 3515-3521.
[10] 罗宏. 光伏型锑化铟红外探测器开路失效研究[J]. 激光与红外, 2010, 40(7): 720.
[11]
[12]
[13] 徐淑丽, 王海珍. 混成式InSb焦平面器件的湿法倒角技术研究[J]. 红外与激光工程, 2007, 36(S2): 107.
[14]
[15]