[1]
[2] Tao Yu, Zhang Zhiquan. Military application of staring infrared focal plane subassembly [J]． Infrared and Laser Engineering, 2001, 30: 70-73． (in Chinese)
[3]
[4] Xavier B, Philippe T. IR detectors design and approach for tactical applications with high reliability without maintenance[C]//SPIE, 2008: 69400.
[5]
[6] Marianne M, Xavier B, Philippe T. IR detector dewar and assemblies for stringent environmental conditions [C]//SPIE, 2007: 6542-6585.
[7] Gong Haimei, Zhang Yani, Zhu Sangen, et al. Study of reliable packaging for IRFPA dector [J]. Journal of Infrared and Millimeter Waves, 2009, 28(2): 85-89. (in Chinese)
[8]
[9]
[10] Fang Guangyu, Gong Haimei, Li Yanjin, et al. Temperature-cycling-reliability of IRFPA device [J]. Infrared and Laser Engineering, 2010, 8: 607-610. (in Chinese)
[11]
[12] Rolin K A. Infrared focal plane array storage life assessment by accelerated aging[J]. Qualitity and Reliability Engineering International, 1998, 14(6): 425-432.
[13] Rogalski A, Chrzanowski K. Infrared devices and techniques[J]. Pto-Electronics Review, 2002, 10(2): 111-136.
[14]
[15]
[16] Li Yanjin, He Li, Yang Jianrong, et al. Study on thermal mismatch stress of HgCdTe infrared focal plane array [J]. Journal of Infrared and Millimeter Waves, 2008, 27 (6): 409-412. (in Chinese)
[17] Li Yanjin. Method of reducing thermal mismatch stress in infrared focal plane assembly [J]. Science and Technology Review, 2011, 29(8): 27-30. (in Chinese)
[18]
[19]
[20] Qiu Hong, Cao Lingxia. InSb IRFPA back lpping technology[J]. Laser and Infrared, 2001, 31(5): 286-287. (in Chinese)
[21]
[22] Xavier B, Philippe T. IR detectors life cycle cost and reliability optimization for tactical applications [C]//SPIE, 2006: 63950D.
[23] Brenire X, Manissadjian A, Vuillermet M, et al.Reliability optimization for IR detectors with compact cryo-coolers[C]// SPIE, 2005: 187.
[24]
[25]
[26] Tian Liping, Zhu Yingfeng, Liu Xiangyun, et al. Back-thining on reliability influence for MW 320256 MCT IRFPA [J]. Infrared Technology, 2013, (10): 629-631. (in Chinese)
[27] Deng Gang, Han Hengli, Zhong Sicheng. Backside-illuminated charge-coupled devices (CCDS) thinning technology [J]. Electronoic Science and Technology, 2014, 27(2): 68-70. (in Chinese)