Research on drilling hole of single crystal by pulse laser

Wu Changshun; Feng Guoying; Liu Caifei

doi:10.3788/IRLA201645.0206007

The laser drilling holes processing experiment was conducted on the silicon under the radiation of a 1064 nm nanosecond repetitive pulse laser. Variation rule of holes' diameter transferring with laser pulse number and the depth of the holes could be both observed through this experiment. Meanwhile it analyzed the thermodynamic process of pulse laser irradiating silicon as well. The result shows that being confined by the narrow hole, the hot plasma expands rapidly inside the channel. It transmits a large fraction of its energy to the hole walls by radiative and convective heat transport, thereby contributing to the radial expansion of the hole. The hole depth growth rate have linear increase with pulse number when the pulse number is under 6, after that it becomes slower and slower until remain stable, which is mainly due to plasma shielding effect.

Research on drilling hole of single crystal by pulse laser

1. Institute of Laser & Micro/Nano Engineering,College of Electronics and Information Engineering,Sichuan University,Chengdu 610064,China

Received Date: 2015-06-05

Rev Recd Date: 2015-07-15

Publish Date: 2016-02-25

Key words:

Abstract: The laser drilling holes processing experiment was conducted on the silicon under the radiation of a 1064 nm nanosecond repetitive pulse laser. Variation rule of holes' diameter transferring with laser pulse number and the depth of the holes could be both observed through this experiment. Meanwhile it analyzed the thermodynamic process of pulse laser irradiating silicon as well. The result shows that being confined by the narrow hole, the hot plasma expands rapidly inside the channel. It transmits a large fraction of its energy to the hole walls by radiative and convective heat transport, thereby contributing to the radial expansion of the hole. The hole depth growth rate have linear increase with pulse number when the pulse number is under 6, after that it becomes slower and slower until remain stable, which is mainly due to plasma shielding effect.

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Reference (31)

[1]	Tunna L, O'Neill W, Khan A, et al. Analysis of laser micro drilled holes through aluminium for micro-manufacturing applications[J]. Optics and Lasers in Engineering, 2005, 43(9):937-950.
[2]
[3]	Burdet N, Brindi F, Carzino R, et al. Very large spot size effect in nanosecond laser drilling efficiency of silicon[J]. Optics Express, 2010, 18(22):22488-22494.
[4]
[5]	Bulgakova N M, Evtushenko A B, Shukhov Y G, et al. Role of laser-induced plasma in ultradeep drilling of materials by nanosecond laser pulses[J]. Applied Surface Science, 2011, 257(24):10876-10882.
[6]
[7]
[8]	Dan L, Duan-Ming Z. Vaporization and plasma shielding during high power nanosecond laser ablation of silicon[J]. Chinese Physics Letters, 2005, 25(4):1368-1371.
[9]
[10]	Tan B. Deep micro hole drilling in a silicon substrate using multi-bursts of nanosecond UV laser pulses[J]. Journal of Micromechanics and Microengineering, 2006, 16(1):109-112.
[11]
[12]	Liu Huixia, Yang Shengjun, Wang Xiao, et al. Experiment study and numerical simulation of pulsed laser ablation crater[J]. Chinese Journal of Lasers, 2009, 36(1):220-223.(in Chinese)刘会霞, 杨胜军, 王霄, 等. 脉冲激光烧蚀凹腔的实验分析与数值模拟[J]. 中国激光, 2009, 36(1):220-223.
[13]
[14]	Allman. Laser-beam Interactions with Materials Physical Principles and Applications[M]. Beijing:Science Press, 1994:55.(in Chinese)奥尔曼. 激光与物质相互作用原理及应用[M]. 北京:科学出版社, 1994:55.
[15]	Tunna L, O'Neill W, Khan A, et al. Analysis of laser micro drilled holes through aluminium for micro-manufacturing applications[J]. Optics and Lasers in Engineering, 2005, 43(9):937-950.
[16]
[17]	Chu Qingchen, Yu Gang, Lu Guoquan, et al. Two-dimensional numerical investigation for the effects of laser process parameters on hole type during laser drilling[J]. Chinese Journal of Lasers, 2011, 38(6):1-6.(in Chinese)褚庆臣, 虞钢, 卢国权, 等. 激光打孔工艺参数对孔型影响的二维数值模拟研究[J]. 中国激光, 2011, 38(6):1-6.
[18]
[19]
[20]	Phipps C R, Turner T P, Harrison R F, et al. Impulse coupling to targets in vacuum by KrF, HF, and CO2 single-pulse lasers[J]. Journal of Applied Physics, 1988, 64(3):1083.
[21]	Semak V V, Knorovsky G A, MacCallum D O, et al. Effect of surface tension on melt pool dynamics during laser pulse interaction[J]. Journal of Physics D:Applied Physics, 2006, 39(3):590-595.
[22]
[23]	Konstantinos Salonitis, Aristidis Stournaras, George Tsoukantas, et al. A theoretical and experimental investigation on limitations of pulsed laser drilling[J]. Journal of Materials Processing Technology, 2007, 183(1):96-103.
[24]
[25]
[26]	Zhou Jun, Tsai Hai-Lung, Wang Peichung. Transport phenomena and keyhole dynamics during pulsed laser welding[J]. Journal of Heat Transfer, 2006, 128(7):680.
[27]	Zhang Duanming, Li Zhihua, Guan Li, et al. Kinetic Principle of Pulse Laser Deposition[M]. Beijing:Science Press, 2011:45-64.(in Chinese)张端明, 李智华, 关丽, 等. 脉冲激光沉积动力学原理[M]. 北京:科学出版社, 2011:45-64.
[28]
[29]
[30]	Herman P R, Breitling D, Ruf A, et al. Fundamental aspects in machining of metals with short and ultrashort laser pulses[C]//SPIE, 2004, 5339:49-63.
[31]	Chan C L, Mazumder J, Chen M M. Effect of surface tension gradient driven convection in a laser melt pool:Three-dimensional perturbation model[J]. Journal of Applied Physics, 1988, 64(11):6166.

Research on drilling hole of single crystal by pulse laser

doi: 10.3788/IRLA201645.0206007

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