Zhang Haiyan, Guan Jian'an, Zhuang Fulong, Wang Yang, Chen Ansen, Gong Haimei. Measurement and error analysis of low temperature deformation of infrared focal plane arrays[J]. Infrared and Laser Engineering, 2016, 45(5): 504001-0504001(3). doi: 10.3788/IRLA201645.0504001
| Citation:
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Zhang Haiyan, Guan Jian'an, Zhuang Fulong, Wang Yang, Chen Ansen, Gong Haimei. Measurement and error analysis of low temperature deformation of infrared focal plane arrays[J]. Infrared and Laser Engineering, 2016, 45(5): 504001-0504001(3). doi: 10.3788/IRLA201645.0504001
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Measurement and error analysis of low temperature deformation of infrared focal plane arrays
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Zhang Haiyan1,2
,
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Guan Jian'an1,2
,
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Zhuang Fulong1,2
,
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Wang Yang1,2
,
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Chen Ansen1,2
,
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Gong Haimei1,2
- 1.
State Key Laboratories of Transducer Technology,Shanghai Institute of Technical Physics,Chinese Academy of Sciences,Shanghai 200083,China;
- 2.
Key Laboratory of Infrared Imaging Materials and Detectors,Shanghai Institute of Technical Physics,Chinese Academy of Sciences,Shanghai 200083,China
- Received Date: 2015-03-06
- Rev Recd Date:
2015-04-08
- Publish Date:
2016-05-25
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Abstract
Reducing the thermal stress of the functional module is one of the key goals in the process of design and fabrication of focal plane assembly. As a result the characterization and measurement of the deformation of the module at low temperature is required. Generally the thermal stress is characterized by indirect parameters such as the deformation in engineering. Based on this, a measurement method including its error analysis of laser interference used to acquire the deformation of the cooled infrared detector was discussed. This method overcomes the difficulty of temperature control and frosting inherent in the other method. It uses the interference pattern produced in the surface of the standard mirror by interference of coherent light to characterize the deformation of the sample. Tests show that this method can realize the measurement of deformation of real-time temperature changes. As a result an in situ measurement of the deformation of the FPA module packaged in the dewar is realized.
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