Volume 46 Issue 11
Dec.  2017
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Yang Jing, Wu Sijin, Zheng Weiwei, Li Weixian, Yang Lianxiang. Full-field measurement of micro strain of printed circuit board assembly using digital image correlation[J]. Infrared and Laser Engineering, 2017, 46(11): 1103004-1103004(8). doi: 10.3788/IRLA201746.1103004
Citation: Yang Jing, Wu Sijin, Zheng Weiwei, Li Weixian, Yang Lianxiang. Full-field measurement of micro strain of printed circuit board assembly using digital image correlation[J]. Infrared and Laser Engineering, 2017, 46(11): 1103004-1103004(8). doi: 10.3788/IRLA201746.1103004
shu

Full-field measurement of micro strain of printed circuit board assembly using digital image correlation

doi: 10.3788/IRLA201746.1103004
  • 1.

    School of Instrumentation Science and Opto-electronics Engineering,Beijing Information Science and Technology University,Beijing 100101,China;

  • 2.

    Nokia Solutions and Networks System Technology (Beijing) Co.,Ltd.,Beijing 100102,China;

  • 3.

    Department of Mechanical Engineering,Oakland University,Rochester,MI 48309,USA

  • Received Date: 2017-10-10
  • Rev Recd Date: 2017-11-20
  • Publish Date: 2017-11-25
  • A method of full-field micro strain measurement using digital image correlation was proposed to evaluate the risk of printed circuit board assembly failure induced by stress. It outperformed traditional testing methods based on experiment in terms of full-field strain measurement and location of strain concentration. Experimental method based on three-dimensional digital image correlation and stress loading strategy was designed. The risk of circuit board assembly failure was evaluated by the obtained full-field distributions of principle strain and history curves of strain on selected local areas. High repeatability of the presented method, which was better than 100 , was exhibited by the experiments, allowing the obtainment of the circuit board assembly full-field micro strain distribution. Moreover, areas where strain exceeds rated value can be localized easily and exhibited intuitively. The presented method provides important measured data which can be used to improve the circuit board assembly design, reduce the risk of circuit board assembly failure, and protect the safety of electronic components.
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    [2] Chan Y C, Yeung F, Mok T S. Failure analysis of miniaturized multilayer ceramic capacitors in surface mount printed circuit board assemblies[J]. Journal of Materials Science:Materials in Electronics, 1994, 5:25-29.
    [3] Vogel G. Avoiding flex cracks in ceramic capacitors:Analytical tool for a reliable failure analysis and guideline for positioning cercaps on PCBs[J]. Microelectronics Reliability, 2015, 55(9-10):2159-2164.
    [4] Wunderle B, Braun T, May D, et al. Nondestructive failure analysis and simulation of encapsulated 0402 multilayer ceramic chip capacitors under thermal and mechanical loading.[J]. Journal of Electronic Packaging, 2009, 131(1):011012.
    [5] Lv Weimin, Hu Dong, Xie Jinsong, Case study on prognostics technique based on PoF to predict life of PCB[J]. Journal of University of Electronic Science and Technology of China, 2013, 42(2):635-640. (in Chinese)吕卫民, 胡冬, 谢劲松. 基于失效物理的电路板寿命预测案例研究[J]. 电子科技大学学报, 2013, 42(4):635-640.
    [6] Liu Zhimin. Reliability evaluation of FPC under bending stress[C]//Proceedings of 2011 International Conference on Electronic Mechanical Engineering and Information Technology, 2011, 6:2955-2958.
    [7] Medvedev A M. A metalized-hole PCB as a strain gauge[J]. Instruments and Experimental Techniques, 2016, 59(6):879-881.
    [8] Shi Hongbin, Ikezawa Satoshi, Ueda Toshitsugu. A novel method for evaluating triaxial strain gages used in printed circuit board assemblies (PCBA) strain monitoring[C]//Sensors, 2011 IEEE, 2011:1697-1700.
    [9] Huang Chienyi, Ying Kuoching. Applying strain gauges to measuring thermal warpage of printed circuit boards[J]. Measurement, 2017, 110:239-248.
    [10] Shi Hongbin, Wu Jinchang, Zhang Jing. Selection methodology study of strain gages for printed circuit board strain measurement[J]. Printed Circuit Information, 2009(9):30-35. (in Chinese)史洪宾, 吴金昌, 章晶. 印制电路板应变测量用应变片选用方法研究[J]. 印制电路信息, 2009(9):30-35.
    [11] Wang Yonghong, Dan Xizuo, Li Junrui, et al. Multi-perspective digital image correlation method using a single color camera[J]. Science China Technological Sciences, 2017, 60:1-7.
    [12] Chen Xu, Yang Lianxiang, Xu Nan, et al. Cluster approach based multi-camera digital image correlation:Methodology and its application in large area high temperature measurement[J]. Optics and Laser Technology, 2014, 57:318-326.
    [13] Xue Yuan, Su Yong, Zhang Chi, et al. Full-field wrist pulse signal acquisition and analysis by 3D Digital Image Correlation[J]. Optics and Lasers in Engineering, 2017, 98:76-82.
    [14] Pan B, Wang B, Lubineau G, et al. Comparison of subset-based local and finite element-based global digital image correlation[J]. Experimental Mechanics, 2015, 55(5):887-901.
    [15] Pan Bin, Wang Bo. Research progress in digital volume correlation method[J]. Chinese Science Bulletin, 2017, 62(16):1671-1681. (in Chinese)潘兵, 王博. 数字体图像相关方法研究进展[J]. 科学通报, 2017, 62(16):1671-1681.
    [16] Dai Xianglu, Xie Huimin, Wang Huaixi. Analysis of the error caused by off-plane displacement in two-dimensional digital image correlation measurement[J]. Journal of Experimental Mechanics, 2013, 28(1):10-19. (in Chinese)戴相录, 谢惠民, 王怀喜. 二维数字图像相关测量中离面位移引起的误差分析[J]. 实验力学, 2013, 28(1):10-19.
    [17] Shao Xinxing, Chen Zhenning, Dai Yuntong, et al. Research progress of several key problems in digital image correlation method[J]. Journal of Experimental Mechanics, 2017, 32(2):305-325. (in Chinese)邵新星, 陈振宁, 戴云彤, 等. 数字图像相关方法若干关键问题研究进展[J]. 实验力学, 2017, 32(2):305-325.
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Full-field measurement of micro strain of printed circuit board assembly using digital image correlation

doi: 10.3788/IRLA201746.1103004
  • 1. School of Instrumentation Science and Opto-electronics Engineering,Beijing Information Science and Technology University,Beijing 100101,China;
  • 2. Nokia Solutions and Networks System Technology (Beijing) Co.,Ltd.,Beijing 100102,China;
  • 3. Department of Mechanical Engineering,Oakland University,Rochester,MI 48309,USA
  • Received Date: 2017-10-10
  • Rev Recd Date: 2017-11-20
  • Publish Date: 2017-11-25

Abstract: A method of full-field micro strain measurement using digital image correlation was proposed to evaluate the risk of printed circuit board assembly failure induced by stress. It outperformed traditional testing methods based on experiment in terms of full-field strain measurement and location of strain concentration. Experimental method based on three-dimensional digital image correlation and stress loading strategy was designed. The risk of circuit board assembly failure was evaluated by the obtained full-field distributions of principle strain and history curves of strain on selected local areas. High repeatability of the presented method, which was better than 100 , was exhibited by the experiments, allowing the obtainment of the circuit board assembly full-field micro strain distribution. Moreover, areas where strain exceeds rated value can be localized easily and exhibited intuitively. The presented method provides important measured data which can be used to improve the circuit board assembly design, reduce the risk of circuit board assembly failure, and protect the safety of electronic components.

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