Volume 44 Issue 6
Aug.  2015
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Han Bing, Chen Xin, Rao Peng, Lin Changqing, Sun Shengli, Li Lufang. Applications of ASIC in the long array column of infrared TDI detector[J]. Infrared and Laser Engineering, 2015, 44(6): 1733-1738.
Citation: Han Bing, Chen Xin, Rao Peng, Lin Changqing, Sun Shengli, Li Lufang. Applications of ASIC in the long array column of infrared TDI detector[J]. Infrared and Laser Engineering, 2015, 44(6): 1733-1738.

Applications of ASIC in the long array column of infrared TDI detector

  • Received Date: 2014-10-07
  • Rev Recd Date: 2014-11-17
  • Publish Date: 2015-06-25
  • There always exist some challenges in long array column infrared Time Delay Integration(TDI) detecting system, such as large number of channels, high noise and power dissipation. To solve those problems mentioned above, a new solution was proposed to improve the performance of infrared TDI detecting system with Application Specific Integrated Circuit(ASIC) chip(eight-channel signal conditioning chip). Meanwhile, it helped to light the weight and reduce the system volume. In the system, the noise and dissipation both reduced to half than before. The average noise of system was 1.42 mV with power of 0.73 W. More higher integration was achieved by Readout Integrated Circuit(ROIC), design complexity and workload were reduced. It provides technical support and practical foundation for micro miniaturization aerospace remote sensing satellite development.
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    [5] Markus Loose, Edward Cheng, James Lohr, et al. Control electronics for large mosaics of SIDECAR ASIC driven detectors[C]//SPIE, 2012, 8453: 8453lQ.
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    [19] Dong Meifeng, Chen Xing, Qiu Guangyin, et al. The characteristic analysis and optimization design for HgCdTe TDI infrared detector array[C]//SPIE, 2011, 8193: 1-9.
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Applications of ASIC in the long array column of infrared TDI detector

  • 1. Shanghai Institute of Technical Physics of Chinese Academy of Sciences,Shanghai 200083,China;
  • 2. Key Laboratory of Infrared System Detection and Imaging Technology,Chinese Academy of Sciences,Shanghai 200083,China

Abstract: There always exist some challenges in long array column infrared Time Delay Integration(TDI) detecting system, such as large number of channels, high noise and power dissipation. To solve those problems mentioned above, a new solution was proposed to improve the performance of infrared TDI detecting system with Application Specific Integrated Circuit(ASIC) chip(eight-channel signal conditioning chip). Meanwhile, it helped to light the weight and reduce the system volume. In the system, the noise and dissipation both reduced to half than before. The average noise of system was 1.42 mV with power of 0.73 W. More higher integration was achieved by Readout Integrated Circuit(ROIC), design complexity and workload were reduced. It provides technical support and practical foundation for micro miniaturization aerospace remote sensing satellite development.

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