Volume 42 Issue 2
Feb.  2014
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Chen Yongyuan, Deng Jun, Shi Yanli, Miao Pei, Yang Lipeng. ICP etching in InAs/GaSb type Ⅱ superlattice infrared detector material[J]. Infrared and Laser Engineering, 2013, 42(2): 433-437.
Citation: Chen Yongyuan, Deng Jun, Shi Yanli, Miao Pei, Yang Lipeng. ICP etching in InAs/GaSb type Ⅱ superlattice infrared detector material[J]. Infrared and Laser Engineering, 2013, 42(2): 433-437.

ICP etching in InAs/GaSb type Ⅱ superlattice infrared detector material

  • Received Date: 2012-06-12
  • Rev Recd Date: 2012-07-13
  • Publish Date: 2013-02-25
  • ICP (Inductively Couple Plasma) etching in InAs/GaSb type Ⅱ superlattice infrared detector material with Cl2/Ar and SiCl4/Ar were studied. The results show that the etching depth is linear with etching time for both etching gases. The etching rate is 100 nm/min at a set of conditions: RF power of 50 W, SiCl4 flow for 3 sccm, Ar to 9 sccm, the standard operating pressure is 2 mTorr. The etching rate did not depend on the doping concentration. The Ar flow fluctuation has no significant effect on etching rate when using SiCl4/Ar as the etch gases. But this condition exists in Cl2/Ar, especially when the flow of Ar under 3 sccm, and the etching rate droped with the reduction of Ar flow.
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    [5] 陈慧娟, 郭杰, 丁嘉欣, 等. InAs/GaSb超晶格红外探测器台面湿法腐蚀研究[J]. 显微、测量、微细加工技术与设备, 2008, 45(5): 298-301.
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    [12] Pearton S J, Chakrabarti U K, Hobson W S, et al. Cl2 and SiCl4 reactive ion etching of In-based Ⅲ-Ⅴsemiconductors[J]. Electrochem Soc, 1990, 137(10): 3188-3202.
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    [23] Elena Plis, Stephen Myers, Arezou Khoshakhlagh, et al. InAs/GaSb strained layer superlattice detectors with nBn design[J]. Infrared Physics Technology, 2009, 52: 335-339.
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ICP etching in InAs/GaSb type Ⅱ superlattice infrared detector material

  • 1. Laboratory of Beijing Photoelectron Technology,Beijing University of Technology,Beijing 100124,China;
  • 2. Kunming Institute of Physics,Kunming 650223,China

Abstract: ICP (Inductively Couple Plasma) etching in InAs/GaSb type Ⅱ superlattice infrared detector material with Cl2/Ar and SiCl4/Ar were studied. The results show that the etching depth is linear with etching time for both etching gases. The etching rate is 100 nm/min at a set of conditions: RF power of 50 W, SiCl4 flow for 3 sccm, Ar to 9 sccm, the standard operating pressure is 2 mTorr. The etching rate did not depend on the doping concentration. The Ar flow fluctuation has no significant effect on etching rate when using SiCl4/Ar as the etch gases. But this condition exists in Cl2/Ar, especially when the flow of Ar under 3 sccm, and the etching rate droped with the reduction of Ar flow.

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